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 PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
FEATURES
* Two LVDS outputs * Selectable crystal oscillator interface or LVCMOS/LVTTL single-ended input * Supports the following output frequencies: 212.5MHz, 187.5MHz, 159.375MHz, 106.25MHz and 53.125MHz * VCO range: 560MHz - 680MHz * RMS phase jitter @ 212.5MHz, using a 26.5625MHz crystal (637kHz - 10MHz): 0.65ps (typical) * Full 3.3V or 2.5V supply modes * -40C to 85C ambient operating temperature
GENERAL DESCRIPTION
The ICS844002I is a 2 output LVDS Synthesizer optimized to generate Fibre Channel reference HiPerClockSTM clock frequencies and is a member of the HiPerClocksTM family of high performance clock solutions from ICS. Using a 26.5625MHz 18pF parallel resonant crystal, the following frequencies can be generated based on the 2 frequency select pins (F_SEL[1:0]): 212.5MHz, 187.5MHz, 159.375MHz, 106.25MHz and 53.125MHz. The ICS844002I uses ICS' 3 rd generation low phase noise VCO technology and can achieve <1ps typical rms phase jitter, easily meeting Fibre Channel jitter requirements. The ICS844002I is packaged in a small 20-pin TSSOP package.
ICS
FREQUENCY SELECT FUNCTION TABLE
Inputs Input Frequency (MHz) 26.5625 26.5625 26.5625 26.5625 23.4375 F_SEL1 F_SEL0 0 0 1 1 0 0 1 0 1 0 M Divider Value 24 24 24 24 24 N Divider Value 3 4 6 12 3 M/N Divider Value 8 6 4 2 8 Output Frequency (MHz) 212.5 159.375 106.25 53.125 187.5
PIN ASSIGNMENT
nc VDDO Q0 nQ0 MR nPLL_SEL nc VDDA F_SEL0 VDD 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VDDO Q1 nQ1 GND VDD nXTAL_SEL TEST_CLK XTAL_IN XTAL_OUT F_SEL1
ICS844002I
20-Lead TSSOP 6.5mm x 4.4mm x 0.92mm package body G Package Top View
BLOCK DIAGRAM
F_SEL[1:0] Pulldown nPLL_SEL
Pulldown
2
Q0
TEST_CLK Pulldown
26.5625MHz
1
1
XTAL_IN
OSC
XTAL_OUT nXTAL_SEL
Pulldown
0
Phase Detector
VCO 637.5MHz
(w/26.5625MHz Reference)
F_SEL[1:0] 0 0 /3 0 1 /4 1 0 /6 11 /12
nQ0
Q1 nQ1
0
M = 24 (fixed)
MR
Pulldown
The Preliminary Information presented herein represents a product in prototyping or pre-production. The noted characteristics are based on initial product characterization. Integrated Circuit Systems, Incorporated (ICS) reserves the right to change any circuitry or specifications without notice. 844002AGI www.icst.com/products/hiperclocks.html REV. A JUNE 14, 2005
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PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
TABLE 1. PIN DESCRIPTIONS
Number 1, 7 2, 20 3, 4 5 Name nc VDDO Q0, nQ0 MR Type Unused Power Ouput Input Description No connect. Output supply pins. Differential output pair. LVDS interface levels. Active HIGH Master Reset. When logic HIGH, the internal dividers are reset causing the true outputs Qx to go low and the inver ted outputs nQx Pulldown to go high. When logic LOW, the internal dividers and the outputs are enabled. LVCMOS/LVTTL interface levels. Selects between the PLL and TEST_CLK as input to the dividers. When Pulldown LOW, selects PLL (PLL Enable). When HIGH, deselects the reference clock (PLL Bypass). LVCMOS/LVTTL interface levels. Analog supply pin. Pulldown Frequency select pins. LVCMOS/LVTTL interface levels. Core supply pin. Parallel resonant cr ystal interface. XTAL_OUT is the output, XTAL_IN is the input. Pulldown LVCMOS/LVTTL clock input. Selects between cr ystal or TEST_CLK inputs as the the PLL Reference Pulldown source. Selects XTAL inputs when LOW. Selects TEST_CLK when HIGH. LVCMOS/LVTTL interface levels. Power supply ground. Differential output pair. LVDS interface levels.
6 8 9, 11 10, 16 12, 13 14 15 17 18, 19
nPLL_SEL VDDA F_SEL0, F_SEL1 VDD XTAL_OUT, XTAL_IN TEST_CLK nXTAL_SEL GND nQ1, Q1
Input Power Input Power Input Input Input Power Output
NOTE: Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol CIN RPULLDOWN Parameter Input Capacitance Input Pulldown Resistor Test Conditions Minimum Typical 4 51 Maximum Units pF k
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PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
4.6V -0.5V to VCC + 0.5V 10mA 15mA 73.2C/W (0 lfpm) -65C to 150C NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC Inputs, VI Outputs, IO Continuous Current Surge Current Package Thermal Impedance, JA Storage Temperature, TSTG
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = VDDO = 3.3V5%, TA = -40C TO 85C
Symbol VDD VDDA VDDO IDD IDDA IDDO Parameter Core Supply Voltage Analog Supply Voltage Output Supply Voltage Power Supply Current Analog Supply Current Output Supply Current Test Conditions Minimum 3.135 3.135 3.135 Typical 3.3 3.3 3.3 TBD TBD TBD Maximum 3.465 3.465 3.465 Units V V V mA mA mA
TABLE 3B. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = VDDO = 2.5V5%, TA = -40C TO 85C
Symbol VDD VDDA VDDO IDD IDDA IDDO Parameter Core Supply Voltage Analog Supply Voltage Output Supply Voltage Power Supply Current Analog Supply Current Output Supply Current Test Conditions Minimum 2.375 2.375 2.375 Typical 2.5 2.5 2.5 TBD TBD TBD Maximum 2.625 2.625 2.625 Units V V V mA mA mA
TABLE 3C. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = VDDA = VDDO = 3.3V5% OR 2.5V5%, TA = -40C TO 85C
Symbol VIH VIL IIH Parameter Input High Voltage Input Low Voltage Input High Current Input Low Current TEST_CLK, MR, F_SEL0, F_SEL1, nPLL_SEL, nXTAL_SEL, TEST_CLK, MR, F_SEL0, F_SEL1, nPLL_SEL, nXTAL_SEL, Test Conditions VDD = 3.3V VDD = 2.5V VDD = 3.3V VDD = 2.5V VDD = VIN = 3.465 or 2.5V VDD = 3.465V or 2.5V, VIN = 0V -150 Minimum Typical 2 1.7 -0.3 -0.3 Maximum VDD + 0.3 VDD + 0.3 0.8 0.7 150 Units V V V V A
IIL
A
844002AGI
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
TABLE 3D. LVDS DC CHARACTERISTICS, VDD = VDDA = VDDO = 3.3V5%, TA = -40C TO 85C
Symbol VOD VOD VOS VOS Parameter Differential Output Voltage VOD Magnitude Change Offset Voltage VOS Magnitude Change Test Conditions Minimum Typical 350 40 1.45 50 Maximum Units mV mV V mV
TABLE 3E. LVDS DC CHARACTERISTICS, VDD = VDDA = VDDO = 2.5V5%, TA = -40C TO 85C
Symbol VOD VOD VOS VOS Parameter Differential Output Voltage VOD Magnitude Change Offset Voltage VOS Magnitude Change Test Conditions Minimum Typical 350 40 1.2 50 Maximum Units mV mV V mV
TABLE 4. CRYSTAL CHARACTERISTICS
Parameter Mode of Oscillation Frequency Equivalent Series Resistance (ESR) Shunt Capacitance Drive Level NOTE: Characterized using an 18pF parallel resonant crystal. 23.33 Test Conditions Minimum Typical 26.5625 Maximum 28.33 50 7 1 Units MHz pF mW Fundamental
844002AGI
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
Test Conditions F_SEL[1:0] = 00 F_SEL[1:0] = 01 F_SEL[1:0] = 10 F_SEL[1:0] = 11 Minimum 186.67 140 93.33 46.67 TBD 212.5MHz, (637kHz - 10MHz) 159.375MHz, (637kHz - 10MHz) 0.65 0.61 0.74 0.64 0.80 400 Typical Maximum 226.66 170 113.33 56.66 Units MHz MHz MHz MHz ps ps ps ps ps ps ps %
TABLE 5A. AC CHARACTERISTICS, VDD = VDDA = VDDO = 3.3V5%, TA = -40C TO 85C
Symbol Parameter
fOUT
Output Frequency
tsk(o)
Output Skew; NOTE 1, 2
tjit(O)
RMS Phase Jitter (Random); NOTE 3
106.25MHz, (637kHz -10MHz) 53.125MHz, (637kHz - 10MHz) 187.5MHz, (637kHz - 10MHz)
tR / tF
Output Rise/Fall Time
20% to 80%
odc Output Duty Cycle 50 NOTE 1: Defined as skew between outputs at the same supply voltages and with equal load conditions. Measured at VDDO/2. NOTE 2: This parameter is defined in accordance with JEDEC Standard 65. NOTE 3: Please refer to the Phase Noise Plot.
TABLE 5B. AC CHARACTERISTICS, VDD = VDDA = VDDO = 2.5V5%, TA = -40C TO 85C
Symbol Parameter Test Conditions F_SEL[1:0] = 00 fOUT Output Frequency F_SEL[1:0] = 01 F_SEL[1:0] = 10 F_SEL[1:0] = 11 Minimum 186.67 140 93.33 46.67 TBD 212.5MHz, (637kHz - 10MHz) 159.375MHz, (637kHz - 10MHz) 0.65 0.61 0.74 0.64 0.80 430 Typical Maximum 226.66 170 113.33 56.66 Units MHz MHz MHz MHz ps ps ps ps ps ps ps %
tsk(o)
Output Skew; NOTE 2, 4
tjit(O)
RMS Phase Jitter (Random); NOTE 3
106.25MHz, (637kHz -10MHz) 53.125MHz, (637kHz - 10MHz) 187.5MHz, (637kHz - 10MHz)
tR / tF
Output Rise/Fall Time
20% to 80%
odc Output Duty Cycle 50 NOTE 1: Defined as skew between outputs at the same supply voltages and with equal load conditions. Measured at VDDO/2. NOTE 2: This parameter is defined in accordance with JEDEC Standard 65. NOTE 3: Please refer to the Phase Noise Plot.
844002AGI
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
PARAMETER MEASUREMENT INFORMATION
Qx
3.3V5% POWER SUPPLY + Float GND -
SCOPE
2.5V5% POWER SUPPLY + Float GND -
Qx
SCOPE
LVDS
nQx
LVDS
nQx
3.3V CORE/3.3V OUTPUT LOAD AC TEST CIRCUIT
2.5V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
nQx 80% Qx nQy Qy
tsk(o)
80% VSW I N G
Clock Outputs
20% tR tF
20%
OUTPUT SKEW
OUTPUT RISE/FALL TIME
Phase Noise Plot
Noise Power
nQ0, nQ1 Q0, Q1
t PW
t
PERIOD
Phase Noise Mask
odc =
f1 Offset Frequency f2
t PW t PERIOD
x 100%
RMS Jitter = Area Under the Masked Phase Noise Plot
RMS PHASE JITTER
844002AGI
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
VDD
VDD
out
out
DC Input
LVDS
100
VOD/ VOD out
DC Input
LVDS
out
VOS/ VOS
DIFFERENTIAL OUTPUT VOLTAGE SETUP
OFFSET VOLTAGE SETUP
844002AGI
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. The ICS844002I provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VDD, VDDA, and VDDO should be individually connected to the power supply plane through vias, and bypass capacitors should be used for each pin. To achieve optimum jitter performance, power supply isolation is required. Figure 1 illustrates how a 10 resistor along with a 10F and a .01F bypass capacitor should be connected to each VDDA.
3.3V or 2.5V VDD .01F V DDA .01F 10F 10
FIGURE 1. POWER SUPPLY FILTERING
CRYSTAL INPUT INTERFACE
The ICS844002I has been characterized with 18pF parallel resonant crystals. The capacitor values shown in Figure 2 below were determined using a 26.5625MHz 18pF parallel resonant crystal and were chosen to minimize the ppm error.
XTAL_OUT C1 33p X1 18pF Parallel Crystal XTAL_IN C2 27p
ICS844002I
Figure 2. CRYSTAL INPUt INTERFACE
844002AGI
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
the receiver input. For a multiple LVDS outputs buffer, if only partial outputs are used, it is recommended to terminate the un-used outputs.
3.3V, 2.5V LVDS DRIVER TERMINATION
A general LVDS interface is shown in Figure 3. In a 100 differential transmission line environment, LVDS drivers require a matched load termination of 100 across near
2.5V or 3.3V VDD LVDS_Driv er + R1 100
-
100 Ohm Differential Transmission Line
FIGURE 3. TYPICAL LVDS DRIVER TERMINATION
844002AGI
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
RELIABILITY INFORMATION
TABLE 6.
JAVS. AIR FLOW TABLE
FOR
20 LEAD TSSOP
JA by Velocity (Meters per Second)
0
Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 114.5C/W 73.2C/W
200
98.0C/W 66.6C/W
500
88.0C/W 63.5C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS844002I is: 2914
844002AGI
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
20 LEAD TSSOP
PACKAGE OUTLINE - G SUFFIX
FOR
TABLE 7. PACKAGE DIMENSIONS
SYMBOL MIN N A A1 A2 b c D E E1 e L aaa 0.45 0 -4.30 0.65 BASIC 0.75 8 0.10 -0.05 0.80 0.19 0.09 6.40 6.40 BASIC 4.50 20 1.20 0.15 1.05 0.30 0.20 6.60 Millimeters MAX
Reference Document: JEDEC Publication 95, MO-153
844002AGI
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REV. A JUNE 14, 2005
PRELIMINARY
Integrated Circuit Systems, Inc.
ICS844002I
FEMTOCLOCKSTMCRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
TABLE 9. ORDERING INFORMATION
Part/Order Number ICS844002AGI ICS844002AGIT Marking ICS844002AGI ICS844002AGI Package 20 Lead TSSOP 20 Lead TSSOP Shipping Packaging tube 2500 tape & reel Temperature -40C to 85C -40C to 85C
The aforementioned trademarks, HiPerClockSTM and FEMTOCLOCKSTM are trademarks of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries. While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments. 844002AGI
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